Technical Director / System Engineer Sub-Micron Die-Attach (m/f/d)
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Finetech
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Berlin, Germany, Europe
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Application Deadline: November 30, 2024

Do you want to develop revolutionary technologies, master complex challenges and push the boundaries of what is possible? Are you interested in playing a decisive role in shaping the future of an industry-leading high-tech company?

As Technical Director with us, you have this opportunity. Bring your expert knowledge to our die bonder division and lead a dedicated team of engineers into a new era of mechanical engineering. Are you ready for the next step?

Your tasks:

  • You lead a highly motivated team of engineers and specialists
  • Together, they develop disruptive machine concepts for the “Sub-Micron Die-Attach” business area and implement them directly in an agile prototype phase
  • You are responsible for the conception, planning and implementation of projects in our die bonder division
  • You work closely with the sales, production and quality assurance teams and find solutions that exceed customer expectations
  • You develop your team through coaching, mentoring and training
  • You ensure compliance with schedules, budgets and quality standards

Your profile:

  • Completed studies in mechanical engineering, electrical engineering or a comparable field
  • Proven success in a responsible position in the introduction of revolutionary innovations in special machine construction
  • Comprehensive technical understanding of complex production processes and machines at system level
  • Proven success in leading teams and implementing innovation projects
  • Strong analytical and problem-solving skills
  • Strong communication and leadership skills
  • High self-motivation and the ability to work in a dynamic environment

Are you interested? Then we look forward to receiving your application!
Please send your detailed application documents in PDF format, stating your salary expectations and the earliest possible starting date, to jobs@finetech.de .

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