Imagine being able to shape the future of special purpose machine construction – developing innovative technologies, mastering complex challenges and pushing the boundaries of what is possible. As a Sub-Micron Die-Attach Software Architect with us, you have just that chance. Bring your expert knowledge in the field of “die bonders” and lead a dedicated team of engineers on the way to new heights of technology. Are you ready to take the next step? Apply now and be part of a revolutionary era in mechanical engineering.