PIC Packaging Engineer Opportunity in Deep Tech Scale-Up
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PhotonFirst
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Alkmaar, Netherlands, Europe
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Application Deadline: January 31, 2025

Job Type:

Job Description:
The Role:
Work together in an interdisciplinary R&D and Operations team, developing PIC packages from design to production.
Engineer PIC packages based on functional needs and packaging process compatibility.
Assemble of prototypes and fine-tuning of packaging processes for scaling up production.
Execute, test and analyse performance, in both process and package design.
Maintain equipment to ensure product quality and minimize production downtime.
Bridging the capabilities and mindset from innovative R&D developments to operational excellence.

Responsibilities:

Requirements:
You
Like the dynamics of a small, fast-moving company.
Have a passion for high tech and are willing to learn about our unique technology.
Applied Science (HBO) degree in Mechanical/Physics/Electrical engineering with preferably 2 years experience in a production environment.
Have affinity with micro-assemblies, photonics, electronics and/ or automation software.
Apply good practice of documentation, operational efficiency and quality control.
Are experienced with the development of test setups and processes.
Are living in The Netherlands and  available to operate from our office in Alkmaar.

Salary Range:

Benefits:
What we offer:
Opportunity to join a front-runner in the Photonics industry;
Unique chance to become a PIC packaging expert, by extensive on-the-job training;
Quickly grow into in an autonomous role with responsibility for the design and execution of PIC packaging processes;
Realizing solutions for leading customers in the revolution of integrated photonics;
Engage in an entrepreneurial adventure with the chance to influence the performance of the company and your professional growth;
Awesome high-tech environment and highly educated colleagues driving a unique technology;
A great diversity in your activities.

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