We are working on exciting projects, connecting materials to systems, to drive new innovations that enable a wide range of advanced Logic-Memory devices and technologies, and associated material and processes interactions. You can be part of this cutting-edge modeling and design team, where you will have the opportunity to model and simulate new technologies that answers the continuous demands for scaled devices, denser interconnects that significantly improves the system Power, Performance and Area.

Your primary responsibility will be developing various process and device models using Technology Computer-Aided Design (TCAD) to enable predictive analysis of emerging memory and future 2nm technologies (deep sub-submicron FET architectures, including nanowires and Finfet). You will also be developing calibration simulations and hardware correlations. You will be directly interacting with a talented and diverse multi-national team of AMAT technical staff to identify and address key issues to improve performance and scalability.