Assignment 1 – Repeated pattern recognition and removal: Despite applying the penalty terms, it is seen that in some cases there exist a crosstalk among the components of a CWM. As the device topography map has a repeated pattern, so is the crosstalk in the bare wafer map. It is crucial to detect the repeated device pattern in the bare wafer map and remove it as a post processing step. The goal of this assignment is to gain a comprehensive understanding about the existing methods in the field of repeated pattern recognition. The literature review will be then followed by proposing the most feasible solution (with respect to accuracy and computation cost) to the existing problem. Assignment 2 – Constrained Continuous Wafermap: Despite applying the penalty terms, it is seen that in some cases the components obtain unexpected values. Therefore, it is beneficial to apply bound constraints to the minimization problem while avoiding iterative numerical approaches.