As the Twinscan platform is being used in a wider range of customer substrates, for example silicon carbide, 3d NAND storage, packaging applications, we see cases where the max throughput sequence is systematically not robust enough, however the robust sequence is slower, costing the customer productivity (=lower profit). In this assignment, you will investigate the possibility of using measurements of the first wafer of a new product, to determine the fastest sequence that will still be robust. Depending on your experiences, this can be demonstrated either through models or a demonstrator prototype. You will report your findings to the measure sequence subfunction team.