Job Type:
Full-time

Job Description:
As we are scaling up InSpek’s operations, we are looking for a full-time Senior PIC Packaging & Characterization Engineer who will be responsible for the steps that turn InSpek’s PICs into an actual sensing probe — characterization, optical packaging, and mechanical packaging/assembly. You will work closely with the PIC design and layout team, component suppliers, and contract manufacturers to develop and test characterisation processes. You will also create low-cost, high-quality packaging solutions that meet the needed performance and reliability standards.

Responsabilities:
Manage PIC packaging from design to production, including creating prototypes and working with contract manufacturers.
o Test and improve packaging solutions, focusing on optical, mechanical, and thermal performance, as well as reliability.
o Work with suppliers and contract manufacturers on tasks like sourcing, evaluation, quoting, design for manufacturing (DFM), and placing small orders, eventually scaling up to full production.
o Analyse yields and implement improvements or fixes for every step in the assembly process.
o Oversee the Characterization team – currently made of an Optical Measurement Engineer and an Automation Programming Intern
o Develop innovative low-cost, low-loss fiber packaging by designing and modeling optical and mechanical interfaces for photonic chip coupling.
• Work together with the PIC Design & Layout team to analyze simulations and measurement data and make recommendations to improve performance
• Coordinate R&D and production projects with multi-disciplinary, international partners
• Develop packaging and mechanical encapsulation solutions focused on high performance, reliability, and cost efficiency.
• Document processes and updates to ensure quality standards are maintained.

Requirements:
PhD + 2 years of relevant experience (or equivalent) working with PIC-based products
• Strong experience in PIC testing: proficiency with lab testing techniques and equipment including lasers, detectors, spectrometers, precision positioning setups
• Strong experience in PIC packaging and assembly: alignment and bonding processes, understanding of optical, mechanical, thermal and reliability constraints
• Ability to manage a team and work collaboratively
• Experience in managing complex projects with several parties/contractors
• Good communication skills in English
• Desirable pluses
o Experience with Design for Manufacturing
o Experience with Quality Management System (QMS)
o Experience with CAD (eg SolidWorks, AutoCAD)
o Communicational in French
• Proactivity, creativity, and all the soft skills that will help build the success of InSpek with us!