This position is within the process diagnostics and control (PDC) group, which deals with advanced imaging together with cutting edge image processing algorithms in order to detect, measure and classify nanometer size defects from semiconductor fabrication process steps.

 Application engineers are supposed to maximize the performance of our new defect metrology products through a deep and thorough understanding of use-cases in close technical collaboration with leading-edge chip manufacturing customers.

At a higher expertise level, they also contribute to product development roadmap through spec definition and performance validation.