Prefer a PhD in Materials Science or Electrical Engineering with a semiconductor focus.

Works with program managers, process engineers, NYCreates-CSR ecosystem, and end customers to integrate complex devices on silicon wafers.

Meets deadlines, uses structured problem solving and successfully integrates hundreds of process steps into functional devices in silicon.

Will work in the fabrication and development of BEOL processes and wafer level packaging. Experience should include end to end technology development including: process assumptions, ground rule generation, test site coordination and tape out, test site scheduling, setup and installation, route pipe cleaning,  wafer processing logistics, test and characterization and process debug.

Key technology areas of experience: wafer to wafer bonding – including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Interacts and offers solutions to address external customers unusually complex process issues to address customers High Value Problems (HVP) involving the business unit’s product line.

Participates in strategic planning to integrate research and development processes with both the unit and the Product Business Group’s overall business plan.