Packaging Engineering Development V (E5)
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Applied Materials
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Santa Clara, USA, America

Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging. File for IP on new patentable developments. Be an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and directors/Senior directors across Applied’s business units, including the packaging business unit. Help structure and maintain Applied’s roadmap in Packaging modules, especially as it pertains to panels and how it fits within advanced modules with the industry. Help design experiments to help improve packaging wiring to improve performance, by reducing RC delays and increasing wiring density in various dielectrics, including polymer dielectrics and deposited thin film dielectrics. Represent Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.

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