Laser-Assisted High-throughput Micro-component Assembly
room
TNO
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Eindhoven, Netherlands, Europe

As you can imagine, a lot of things need to fall into place in order to make this happen. One important piece of this puzzle is the placement of the die attach material, which will make both a physical and electrical connection of the component to the substrate. At Holst Centre we developed a laser based technology which is capable of printing ultra-fine dots of die-attach material. For this technology an embossed transparent carrier mask (see figure below) is filled with the die attach material, which is then transferred using a single laser pulse. A crucial part of this is the correct and reproducible filling of the carrier mask. In order to optimize this filling process, an automatic coating setup has been designed and built. The goal of this internship is to use the automatic coating setup to optimize the filling parameters and then based on the findings to oversee the design and building of a dedicated filling tool for further development of the process.

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