Final thesis or internship in the basic field of laser cutting on the topic of technology development (WS24/25)
room
TRUMPF
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Ditzingen, Germany, Europe

Processing a current development topic in the field of laser cutting technology, Process investigation using the latest measuring technology (including high-speed cameras and sensors), Planning and independent execution of tests on high-performance laser cutting systems, Evaluation, processing and interpretation of test results, Other topics possible (image processing, programming, AI, etc.).

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